Supply and commissioning of a temporary wafer bonder tool
Awarded
The competition has ended and a winner has been selected.
This tender is a public supply contract within the meaning of Article 2 of the Public Procurement Act of 17 June 2016, Belgian Official Gazette 14 July 2016. Its object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications (hereinafter referred to as: “the Tool”). The Tool will be used for bonding wafers using a permanent or temporary bonding material/adhesive. The bonding process consists of multiple steps: spin coating, baking/curing and bonding.
Result
- Winner
- SUSS MicroTec Solutions GmbH & Co. KG
- Number of bids
- 0
- Contract value
- €4,080,000
About the bid
- Contact phone
- +32 16287789
- Contact email
- tom.wauters@imec.be
- Address
- Kapeldreef 75, 3001 Heverlee
This tender is a public supply contract within the meaning of Article 2 of the Public Procurement Act of 17 June 2016, Belgian Official Gazette 14 July 2016. Its object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications (hereinafter referred to as: “the Tool”). The Tool will be used for bonding wafers using a permanent or temporary bonding material/adhesive. The bonding process consists of multiple steps: spin coating, baking/curing and bonding.
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Description
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See the full notice
- Contracting authority
- IMEC VZW
- Title
- Supply and commissioning of a temporary wafer bonder tool
- Type
- Main code
- Supplemental codes
- Location
- Arr. Leuven
- Estimated value
- €350,000.00
No supplemental codes from buyer…