Deep Reaction Ion Etcher (DRIE)
Anleggsmaskiner og utstyr
Uppsala universitet needs a Deep Reaction Ion Etcher (DRIE) for their Myfab Uppsala laboratory. The system will be used by many operators in a university laboratory environment and must be easy to use and insensitive to frequent process changes between batches. It needs to support a broad range of etching capabilities, including low to high etch rates, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale, for etching silicon and other compatible materials using photoresist resins and hard masks. The maximum total contract value is 1 SEK.
About the bid
- Contact phone
- 018-471 00 00
- Contact email
- info@uu.se
- Address
- Dag Hammarskjölds Väg 7, 752 37 Uppsala
Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.
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See the full notice
- Contracting authority
- Uppsala universitet
- Title
- Deep Reaction Ion Etcher (DRIE)
- Type
- Main code
- Supplemental codes
- Location
- Uppsala län
- Estimated value
- SEK 1.00
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Supplemental codes added by Cobrief