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    Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics

    Danmarks Tekniske Universitet - DTU

    Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics

    1. Competition notice published

      Oct 8, 1:00 PMOctober 8, 2026 1:00 PM

    2. Questions deadline

      Nov 12, 10:55 PMNovember 12, 2026 10:55 PM

    3. Tender submission deadline

      Nov 23, 10:55 PMNovember 23, 2026 10:55 PM

    4. Tender validity period

      May 23, 9:55 PMMay 23, 2027 9:55 PM

    Brief

    Denmark: Tenders/Danmarks Tekniske Universitet - DTU/Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics
    Brief

    Danmarks Tekniske Universitet - DTU needs an ICP Reactive ion etcher for silicon dielectrics, to be delivered and installed in the DTU Nanolab cleanroom in the Copenhagen area. The instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures to depths of several tens of microns, requiring exceptional process controllability and tunability for ultra-precise, low-rate etches (< 100 nm/min) and high etch rate deep etches (approaching 500 nm/min). It must accommodate all silicon dielectrics of the form SixNy, SixOx, and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists, and UV/DUV photoresists with high mask selectivity. The instrument must be configured for 150 mm wafer processing, with an option for a complete kit for 200 mm wafer processing. DTU will also have the option to purchase one additional identical instrument. Award criteria are Functionality and performance (50%), Quality of submitted samples (30%), and Price (20%).

    About the bid

      DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients. As an open access tool, the Instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures defined by electron beam lithography to depths of several tens of microns. Meeting these demands requires exceptional process controllability and tunability: the system must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight sidewalls and minimal undercut for shallow features, alongside high etch rate deep etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all these masking materials. The user interface must be intuitive and user friendly. The Instrument should be engineered to the highest industrial standards to minimize maintenance, and any required servicing must be straightforward and efficient. The instrument must be configured for 150 mm wafer processing and a complete kit enabling the processing of 200 mm wafers must be included in the tender as an option. Furthermore, DTU will have the option to purchase one more ICP Reactive ion etcher for silicon dielctrics identical to the initial instrument.

      Contact name
      Mikkel Taanum
      Contact phone
      +45 20133820
      Contact email
      miktaa@dtu.dk
      Address
      Anker Engelunds Vej 1, 2800 Kgs. Lyngby

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    Award Criteria

    • Description

      The price for the instrument

    • Description

      The functionality and performance of the tender, based on the tenderers response to appendix 1.

    • Description

      The quality of submitted samples, as described in appendix 1

    Qualification requirements

      Found no qualification requirements in the contract notice.

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    See the full notice

    Contracting authority
    Danmarks Tekniske Universitet - DTU
    Title
    Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics
    Type
    CompetitionPrequalification
    Main code
    42000000Industrial machinery
    Supplemental codes
    38636110Industrial lasers
    Location
    Københavns omegn

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