Desktop System for Rapid PCB and Electronics Prototyping

Acquisition d'un système de gravure de plaques ou computer-to-plate

COMSOPGN a besoin d'un système de gravure de plaques ou computer-to-plate pour une durée de 120 jours. La livraison aura lieu en Haute-Vienne.

LA3673C-UCC-CFT for the Supply of a Fully Integrated Precision Ferroelectric and Piezoelectric Analysis Platform

Education Procurement Service (EPS) needs the supply of a fully integrated Precision Ferroelectric and Piezoelectric Analysis Platform for Tyndall National Institute, University College Cork, with a maximum total value of 435,000 EUR over 48 months. The platform, to be delivered in the South-West region of Ireland, must comprise seven complementary subsystems (Measurement Core, Optical Metrology, Thermal Modules, HV Subsystem, Fixturing and Probing, Workstation, and Infrastructure) and be capable of comprehensive, high-resolution ferroelectric and piezoelectric characterisation of ferroic materials across a broad temperature range. This platform will serve as a unified, high-performance infrastructure for fundamental research and industrial benchmarking of advanced ferroic and piezoelectric materials, supporting the development of next-generation sensors, actuators, and computing architectures.

MY26/ITEAM/S/57

La Universitat Politècnica de València necesita el suministro de equipos de preparación para corte de obleas para la Pilot Line de la UPV (UPV47). El contrato tiene una duración de 3 meses.

MY26/ITEAM/S/46

La Universitat Politècnica de València necesita el suministro de 3 osciloscopios para la Pilot Line de la UPV (UPV33). El contrato tiene una duración de 3 meses.

APECS/INL-17 - CONTRACT FOR THE SUPPLY AND INSTALLATION OF EQUIPMENT AND COMPONENTS WITHIN APECS (ADVANCED PACKAGING AND HETEROGENEOUS INTEGRATION FOR ELECTRONICS COMPONENTS AND SYSTEMS) PILOT LINE

INL - INTERNATIONAL IBERIAN NANOTECHNOLOGY LABORATORY needs the supply and installation of scientific equipment and components, specifically a Pick and Place equipment upgrade including a Wafer Holder, Die Eject Module, and Flip Chip Module, with a maximum total value of 67,000 EUR. The project is funded by ANI - Agencia Nacional de Inovação under the Joint Procurement Agreement signed between INL and Chips JU.