Flip Chip Die Bonder

Brief

FAIR - Facility for Antiproton and Ion Research in Europe GmbH needs a Flip Chip Die Bonder for a 2-month contract, to be delivered in Darmstadt, Kreisfreie Stadt, Germany. This equipment is used to electrically connect semiconductor chips to sensors with micrometer precision, supporting bonding technologies like soldering, thermal bonding, and conductive adhesive bonding. The award criteria are Price (40%), Completeness and Quality of the Bid Documents (12%), Quality Assurance, Acceptance Testing, and Documentation (15%), Delivery time, installation and training (18%), and Repair Services and Sustainability (15%). Suppliers must provide a business and professional liability declaration with a sum insured covering at least three times the order value, a company profile detailing general company data, total number of employees and breakdown for the last three fiscal years, and total turnover and performance-related turnover for the last three financial years. Additionally, suppliers need to provide references for similar projects not older than three years, demonstrating successful use of the offered system at other research institutes or universities, and a self-declaration of compliance with ISO 9001 or an equivalent standard.

About the bid

In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.

Contact phone: +49 6159711987
Contact email: proekf33@gsi.de
Address: Planckstr. 1, 64291 Darmstadt

Custom Assessment Criteria

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Award Criteria

Description
Price criteria for "Preis-Quotient-Methode"
Description
Under this award criterion, an assessment is made of the extent to which the bid documents demonstrate that the proposed system fully meets the technical, qualitative, and functional requirements specified in the procurement documents. In particular, it is important to the contracting authority that the bid clearly shows how the proposed solution fully complies with the order specification. A positive evaluation is given, in particular, for a clearly structured, technically precise, and consistent description of the system configuration and quality assurance. Low scores will be awarded to bids whose documentation is incomplete, contains only general or unreliable statements, or fails to describe the technical implementation and acceptance testing in sufficient detail.
Description
The evaluation focuses on the completeness, traceability, and technical quality of the quality assurance description as well as the technical documentation. The decisive factor is the extent to which the bidder demonstrates that the required quality is ensured, that compliance with the technical requirements is verified through appropriate testing and acceptance procedures, and that the results are documented in a traceable manner. A positive evaluation is given in particular for a clear, complete, and consistent description of the quality assurance measures, the testing and acceptance procedures, and the intended documentation. Bids will receive a lower score if their explanations remain too general, fail to describe essential elements of the testing and documentation concept in sufficient detail, or leave doubts regarding the reliability of the quality assurance and verification process. Evidence of examples of acceptance tests and documentation.
Description
The assessment focuses on the transparency and plausibility of the quoted delivery time, installation, and training. It is particularly important to the client that the delivery time, installation period, and training period specified by the client be confirmed. Shorter, plausibly presented timeframes (delivery time, installation period, and training period) will be evaluated positively. Longer timeframes (delivery time, installation period, and training period) will receive a correspondingly lower score, down to 0 points. Furthermore, the bidder's description of the measures to be taken in the event of impending delivery delays will be evaluated.
Description
The evaluation focuses on the availability of spare parts and on site services, preferably for ten years, service response within 48 h. Availability of spare parts longer than 10 years and service response shorter than 48 h will be evaluated positively. Shorter Availability and longer response time will receive a lower score.

Qualification requirements

Description
The sum insured must cover at least three times the order value.
Documentation Requirement
Business and Professional Liability Declaration (Mit dem Angebot; Mittels Eigenerklärung)
Description
General company data.
Documentation Requirement
Company Profile (Mit dem Angebot; Mittels Eigenerklärung)
Description
Total number of employees and breakdown of the number of employees for the last 3 fiscal years, including administration, development/design, and production.
Documentation Requirement
Company Profile (Mit dem Angebot; Mittels Eigenerklärung)
Description
Statement of the company's total turnover for the last three financial years.
Documentation Requirement
Company Profile - information on total turnover and performance-related turnover (Mit dem Angebot; Mittels Eigenerklärung)
Description
Statement of turnover relating to the specific type of service that is the subject of the contract, for the last three financial years.
Documentation Requirement
Company Profile - information on total turnover and performance-related turnover (Mit dem Angebot; Mittels Eigenerklärung)
Description
Declaration of Availability to be completed and signed by the sub-contractor if partial services are to be passed on to sub-contractors or if the applicant/bidder is using a sub-contractor to demonstrate suitability. If more than one sub-contractor is used, several copies of this form should be filled out. One declaration of commitment should be submitted per sub-contractor.
Documentation Requirement
Declaration of Availability (Mit dem Angebot; Mittels Eigenerklärung)
Description
The reference project must not be more than three years old. The system being offered must already be in successful use at other research institutes or universities.
Documentation Requirement
References (Mit dem Angebot; Mittels Eigenerklärung). Proof of references must be provided. If this proof is not provided, the applicant will be excluded from the process.
Description
Self-Declaration of Compliance with standards within the meaning of ISO 9001 (or an equivalent standard).
Documentation Requirement
Self-Declaration ISO 9001 (Mit dem Angebot; Mittels Eigenerklärung)

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See the full notice

Contracting authority: FAIR - Facility for Antiproton and Ion Research in Europe GmbH
Title: Flip Chip Die Bonder
Type
Main code
Supplemental codes
Location: Darmstadt, Kreisfreie Stadt
Duration: 2 months