Laser Based dicing Tool
Awarded
The competition has ended and a winner has been selected.
The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinafter referred to as: “the Tool”). The tool is designed to be able to singulate wafers by means of a laser-based technique and to edge trim by applying circular cuts. The wafers to be processed consist of copper, LowK or other metal or dielectic films.
Result
- Winner
- DISCO HI-TECH EUROPE GmbH
- Number of bids
- 0
- Contract value
- €1,640,000
About the bid
- Contact phone
- +32 16287789
- Contact email
- tom.wauters@imec.be
- Address
- Kapeldreef 75, 3001 Heverlee
The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinafter referred to as: “the Tool”). The tool is designed to be able to singulate wafers by means of a laser-based technique and to edge trim by applying circular cuts. The wafers to be processed consist of copper, LowK or other metal or dielectic films.
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Award Criteria
Description
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See the full notice
- Contracting authority
- IMEC VZW
- Title
- Laser Based dicing Tool
- Type
- Main code
- Supplemental codes
- Location
- Arr. Leuven
No supplemental codes from buyer…