Maskless Aligner
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In our research group, nanoscopic superconducting circuits are created using lithographic processes on 4-inch wafers. The structures are currently created on photomasks in a fixed design and then transferred to the substrate using photolithography. In order to significantly accelerate the design process of the superconducting circuits, we want to write the structures directly onto the substrate in the future using a maskless aligner.
Result
- Winner
- Heidelberg Instruments Mikrotechnik GmbH
- Number of bids
- 2
- Contract value
- €0
About the bid
- Contact name
- Lehrstuhl für Experimentalphysik (Prof. Eichler)
- Contact phone
- +49 91318528371
- Contact email
- christopher.eichler@fau.de
- Address
- Staudtstr. 7/B2, 91058 Erlangen
In our research group, nanoscopic superconducting circuits are created using lithographic processes on 4-inch wafers. The structures are currently created on photomasks in a fixed design and then transferred to the substrate using photolithography. In order to significantly accelerate the design process of the superconducting circuits, we want to write the structures directly onto the substrate in the future using a maskless aligner.
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See the full notice
- Contracting authority
- Freistaat Bayern, vertreten durch die Universität Erlangen-Nürnberg
- Title
- Maskless Aligner
- Type
- Main code
- Supplemental codes
- Location
- Erlangen, Kreisfreie Stadt
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