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    Semi-Automatic Wafer Grinder

    TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

    Semi-Automatic Wafer Grinder

    1. Competition notice published

      Oct 17, 2025 10:14 AMOctober 17, 2025 10:14 AM

    2. Contract signed

      Feb 3, 12:00 AMFebruary 3, 2026 12:00 AM

    3. Result notice published

      Feb 11, 7:32 AMFebruary 11, 2026 7:32 AM

    Brief

    Finland: Tenders/TEKNOLOGIAN TUTKIMUSKESKUS VTT OY/Semi-Automatic Wafer Grinder

    Awarded

    The competition has ended and a winner has been selected.

    Brief

    Anleggsmaskiner og utstyr

    TEKNOLOGIAN TUTKIMUSKESKUS VTT OY har inngått en avtale med DISCO HI-TEC EUROPE GmbH om å levere en semi-automatisk wafer-sliper med manuell lasting og lossing av wafere på chuck-bordet. Utstyret skal kunne tynne Si, SiC, LiNbO3 og andre typiske halvledende wafere med en diameter på 200 og 300 mm til varierende tykkelser med endepunktkontroll, TTV-profilkontroll, og mulighet til å tynne wafere ned til 10 µm tykkelse med støttetape, samt mulighet til å slipe kun en bestemt avstand fra kant til senter. Utstyret må være nytt og overholde standard sikkerhets- og kontaminasjonskrav for renromsutstyr. Leveransen skal skje i Helsinki-Uusimaa, med en varighet på 2 år, til en verdi av 325 000 euro. Det ble mottatt ett tilbud i konkurransen.

    Result

    Winner
    Disco HiTec Europe GmbH
    Number of bids
    1
    Contract value
    €325,000

    About the bid

      The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process was described in more detail in the invitation to tender documents.Main features of the procedureThe tender process was based on the open procedure applicable to contracts that exceed the EU procurement threshold.

      Contact name
      VTT Technical Research Centre of Finland Ltd
      Contact phone
      +358 20722111
      Contact email
      kilpailutus@vtt.fi
      Address
      PL 1000, 02044 VTT

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    Award Criteria

    • Description

      The evaluation of the tenders was described in section 'Grounds for decision'.

    Qualification requirements

      Found no qualification requirements in the contract notice.

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    See the full notice

    Contracting authority
    TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
    Title
    Semi-Automatic Wafer Grinder
    Type
    ResultPrequalification
    Main code
    42900000Miscellaneous general and special-purpose machinery
    Supplemental codes

    No supplemental codes from buyer…

    Location
    Helsinki-Uusimaa
    Duration
    24 months