Supply and commissioning of a TCB bonder tool relaunch
Awarded
The competition has ended and a winner has been selected.
Its object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications (hereinafter referred to as: “the Tool”). The Tool will be used for bonding dies with micro bumps as interconnects while maintaining a good alignment accuracy under certain atmospheric conditions while applying force and temperature.
Result
- Winner
- Besi Singapore Pte. Ltd.
- Number of bids
- 0
- Contract value
- €2,782,220
About the bid
- Contact phone
- +32 16287789
- Contact email
- tom.wauters@imec.be
- Address
- Kapeldreef 75, 3001 Heverlee
Its object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications (hereinafter referred to as: “the Tool”). The Tool will be used for bonding dies with micro bumps as interconnects while maintaining a good alignment accuracy under certain atmospheric conditions while applying force and temperature.
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Award Criteria
Description
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Qualification requirements
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See the full notice
- Contracting authority
- IMEC VZW
- Title
- Supply and commissioning of a TCB bonder tool relaunch
- Type
- Main code
- Supplemental codes
- Location
- Arr. Leuven
No supplemental codes from buyer…