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    UHV Sputter system

    Universiteit Twente

    UHV Sputter system

    1. Competition notice published

      Mar 22, 10:52 AMMarch 22, 2024 10:52 AM

    2. Change in competition

      Apr 3, 1:45 PMApril 3, 2024 1:45 PM

    3. Change in competition

      Apr 5, 8:01 AMApril 5, 2024 8:01 AM

    4. Supplier selection

      Jun 20, 12:00 AMJune 20, 2024 12:00 AM

    5. Result notice published

      Jul 2, 10:39 AMJuly 2, 2024 10:39 AM

    Brief

    Netherlands: Tenders/Universiteit Twente/UHV Sputter system

    Awarded

    The competition has ended and a winner has been selected.

    Brief

    The MESA+ Institute will invest in a UHV Sputter system to replace the current UHV Sputter systems with a state-of-the-art system that will bring more advanced process control and better process conditions (by means of a UHV system) to the lab.  The system will be used for the deposition of metals onto various samples that have been processed in one or more deposition / lithography steps within the NanoLab facilities. Among these depositions, we outline a few below:  Deposition of Au layers for good electrical contact to electronic devices (typically combined with a Ti interlayer for improved adhesion of the deposited film).  Deposition of Nb layers for superconducting quantum devices such as Josephson junctions or SQUID devices (typically combined with a Pd capping layer). The system will furthermore enable users to etch the samples prior to the deposition, so that the surface of the sample can be cleaned to improve interface transparency in between the deposited layers and the ex-situ layers that have been prepared in other tools prior to loading the samples in the UHV Sputter system.

    Result

    Winner
    PREVAC Sp. z o.o.
    Number of bids
    2
    Contract value
    €375,000

    About the bid

      The MESA+ Institute will invest in a UHV Sputter system to replace the current UHV Sputter systems with a state-of-the-art system that will bring more advanced process control and better process conditions (by means of a UHV system) to the lab.  The system will be used for the deposition of metals onto various samples that have been processed in one or more deposition / lithography steps within the NanoLab facilities. Among these depositions, we outline a few below:  Deposition of Au layers for good electrical contact to electronic devices (typically combined with a Ti interlayer for improved adhesion of the deposited film).  Deposition of Nb layers for superconducting quantum devices such as Josephson junctions or SQUID devices (typically combined with a Pd capping layer). The system will furthermore enable users to etch the samples prior to the deposition, so that the surface of the sample can be cleaned to improve interface transparency in between the deposited layers and the ex-situ layers that have been prepared in other tools prior to loading the samples in the UHV Sputter system.

      Contact name
      Camilio Delfgaauw
      Contact phone
      +31534891512
      Contact email
      c.delfgaauw@utwente.nl
      Address
      Drienerlolaan 5, 7522NB Enschede

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    • Description

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    • Description

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    Qualification requirements

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    See the full notice

    Contracting authority
    Universiteit Twente
    Title
    UHV Sputter system
    Type
    ResultPrequalification
    Main code
    38000000Laboratory, optical and precision equipments (excl. glasses)
    Supplemental codes

    No supplemental codes from buyer…

    Estimated value
    €415,000.00

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