200 mm wafer coating and developing track tool DUV
Expired
The competition has expired without a winner being announced.
- Deadline
- 20. jan.Expired
- Award
- Quality comparison 20%
Brief
VTT Technical Research Centre of Finland Ltd trenger et 200 mm wafer coating og developing track tool DUV for VTT Micronova renrom halvleder front-end prosessering i Helsinki-Uusimaa. Verktøyet skal integreres med et DUV eksponeringsverktøy, men også kunne utvikle wafere fra i-line stepperen i samme anlegg. Det skal ha åpne kassettlastestasjoner, spin coating og developing stasjoner, varme- og kjøleplater, og en modul for integrasjon med DUV eksponeringsverktøyet, samt mulighet for å trekke ut prosesserte wafere i åpne kassetter. Verktøyet må kunne prime wafere med HMDS, coate wafere med DUV resist og BARC, og utvikle DUV og i-line typer eksponert resist, med tilhørende oppvarmings- og kjølearrangementer. Kontrakten har en varighet på 15 måneder. Tildelingskriteriene er pris (80%) og kvalitet (20%). Et vedlikeholdskontraktalternativ må tilbys.
Laboratorie-, optisk- og presisjonsutstyr
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Description
See call for tenders
Source
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Description
See call for tenders
Source
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Who are you up against?
The suppliers who have won similar contracts at TEKNOLOGIAN TUTKIMUSKESKUS VTT OY
From the notice
THE OBJECT OF THE TENDER PROCESS The object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing wafers from the i-line stepper in the same facility. The tool features open cassette loading stations, spin coating and developing stations and hot and cool plates, and a module for integration with the DUV exposure tool. The tool also should have an option of extracting processed wafers in open cassettes. The coating and developing track tool is intended to support silicon semiconductor front end processing of 200 mm wafers, facilitating exposure by DUV stepper or other exposure tool. To this end, it must be capable of priming wafers with HMDS, coating wafers with DUV resist and with BARC, and developing DUV and i-line types of exposed resist, with the associated heating and cooling arrangements. The technical specification of the object of the tender is described in more detail in this Annex 1 of the invitation to tender. The tendered Tool must comply with all technical properties and functionalities, performance specifications and acceptance criteria as set out in Annex 1 and Annex 2 (“Facilities, materials and connector types”). A tender which does not meet one or more of the requirements specified in the Annex 1 and Annex 2, may be rejected for failing to comply with the call for tenders. The comparison criterion for the tenders is economic advantageous (see section "Grounds for decision") with 80 % price weighting and 20 % quality weighting. A reference price has to be given for the equipment that meets all the requirements set in the invitation to tender, especially its Annex 1. The object of the tender process is described in more detail in the invitation to tender documents. Partial tenders will not be accepted. OPTIONS (mandatory) The following are mandatory options (to be offered): - Maintenance contract (See section Maintenance contract option). VTT does not commit to purchase the options. The price(s) of the option(s) are not taken into account when comparing tenders.Main features of the procedureThe tender process is based on the open procedure applicable to contracts that exceed the EU procurement threshold.
Contact
VTT Technical Research Centre of Finland Ltdkilpailutus@vtt.fi- CompetitionType
- Helsinki-UusimaaLocation
- 38000000Main codeLaboratory, optical and precision equipments (excl. glasses)
- 38540000Machines and apparatus for testing and measuring38810000Industrial process control equipment50430000Repair and maintenance services of precision equipment