2025-0896770 Nanoindenter and Tribometer for Aarhus University

The procurement of the Supply, Installation and Commissioning of a Focused Ion Beam Scanning Electron Microscope (FIB-SEM) with Gallium Ion Source

Danmarks Tekniske Universitet (DTU) needs the supply, delivery, installation, commissioning, and acceptance of one focused ion beam scanning electron microscope (FIB-SEM) dual-beam platform. This instrument will serve a multi-user research environment in the Copenhagen area for high-resolution surface imaging, site-specific cross-sectioning, TEM lamella preparation (including automated workflows), 3D FIB-SEM tomography, gas-assisted deposition and etching, nanoscale manipulation, and elemental microanalysis by energy-dispersive X-ray spectroscopy (EDS) and ToF-SIMS. The award criteria are Price (30%) and Quality of the solution (70%). Suppliers must provide at least 3 references for comparable agreements, each with a value of at least DKK 10,000,000, concerning the supply, delivery, installation, commissioning, and acceptance of a FIB-SEM dual-beam platform or a comparable service, with the agreement not being more than 5 years old.

Desktop Scanning Electron Microscope (SEM)

Danmarks Tekniske Universitet (DTU) har brug for levering af et desktop scanning elektronmikroskop (SEM) til en maksimal totalværdi på 130.000 EUR. SEM'et skal bruges til topografisk billeddannelse og kemisk analyse af metallografiske prøver, primært ikke-ledende mekanisk polerede epoxyforme med tværsnitskomponenter og samlinger af elektronik. Det forventes, at SEM'et er kompakt, robust, stabilt, klar til at køre 24/7 uden avanceret vedligeholdelse og let at betjene efter kort træning. Carl Zeiss A/S har tidligere haft lignende kontrakter.

Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics

Danmarks Tekniske Universitet - DTU needs an ICP Reactive ion etcher for silicon dielectrics, to be delivered and installed in the DTU Nanolab cleanroom in the Copenhagen area. The instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures to depths of several tens of microns, requiring exceptional process controllability and tunability for ultra-precise, low-rate etches (< 100 nm/min) and high etch rate deep etches (approaching 500 nm/min). It must accommodate all silicon dielectrics of the form SixNy, SixOx, and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists, and UV/DUV photoresists with high mask selectivity. The instrument must be configured for 150 mm wafer processing, with an option for a complete kit for 200 mm wafer processing. DTU will also have the option to purchase one additional identical instrument. Award criteria are Functionality and performance (50%), Quality of submitted samples (30%), and Price (20%).