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    Blade Dicing Saw

    Danmarks Tekniske Universitet - DTU

    Blade Dicing Saw

    1. Result notice published

      Aug 20, 12:00 PMAugust 20, 2026 12:00 PM

    Brief

    Denmark: Tenders/Danmarks Tekniske Universitet - DTU/Blade Dicing Saw
    Procedure
    Without prior noticeTwo stages
    Agreement
    Buying goods

    Brief

    Danmarks Tekniske Universitet - DTU har til hensigt at indgå en aftale med DISCO HI-TEC EUROPE GmbH om levering af et semi-automatisk wafer dicing system. Systemet skal kunne behandle wafere op til 300 mm i diameter og understøtte konventionel wafer dicing, cirkulær wafer skæring, multi-cirkulær skæring samt kanttrimning af cirkulært skårne wafere. Udstyret skal også kunne behandle hårde og tykke materialer som siliciumcarbid (SiC) og piezoelektriske substrater, og vil blive installeret og anvendt i DTU Nanolabs multi-bruger renrumsmiljø.

    Result

    TED
    • DISCO HI-TEC EUROPE GmbH
      Winner
    • Number of bids
      0
    • Contract value
      €199,900

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    From the notice

    • DTU Nanolab intends to procure a semi-automatic wafer dicing system for research and cleanroom operations. The equipment must be capable of processing wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting, and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. The system must also be capable of processing hard and thick materials used in advanced microfabrication and semiconductor research, including materials such as silicon carbide (SiC) and piezoelectric substrates. The equipment will be installed and operated in DTU Nanolab's multi-user cleanroom environment and will support research, innovation, and industrial collaboration activities.

    • Contact

      Andrea Albertaalb@dtu.dk
    • Type
      Result · Prequalification
    • Main code
      Laboratory, optical and precision equipments (excl. glasses)
      38000000

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