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Sweden: Tenders/Uppsala universitet/Deep Reaction Ion Etcher (DRIE)

  1. Competition notice published

    Oct 6, 12:07 PMOctober 6, 2026 12:07 PM

  2. Change in competition

    Oct 9, 10:14 AMOctober 9, 2026 10:14 AM

  3. Change in competition

    Nov 2, 7:04 AMNovember 2, 2026 7:04 AM

  4. Tender submission deadline

    Nov 16, 11:00 PMNovember 16, 2026 11:00 PM

  5. Contract start date

    Dec 14, 11:00 PMDecember 14, 2026 11:00 PM

  6. Tender validity period

    Feb 16, 2027 11:00 PMFebruary 16, 2027 11:00 PM

  7. Contract end date

    Dec 13, 2037 11:00 PMDecember 13, 2037 11:00 PM

Brief

Deep Reaction Ion Etcher (DRIE)

Deadline
Nov 17,2 days left
Procedure
OpenSingle stage
Agreement
Buying goods
Estimated value
SEK 1until Dec 2037

Brief

Uppsala University needs a Deep Reactive Ion Etcher (DRIE) for Myfab Uppsala’s university laboratory in Uppsala County; the notice states a maximum total contract value of 1 SEK. The system must transfer patterns defined by photo- and electron-beam lithography across substrate sizes down to a few nanometres, and support etching silicon and compatible materials using photoresist resins and hard masks. It will be used by many operators and must be easy to operate and tolerant of frequent process changes between batches, while providing capabilities ranging from low to high etch rates, wafer dicing, high uniformity, high open area, high aspect ratios and nanoscale etching.

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From the notice

  • Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.

  • Contact

    info@uu.se
  • Type
    Competition
  • Location
    Uppsala län
  • Main code
    Industrial machinery
    42000000
  • 42900000Miscellaneous general and special-purpose machinery

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