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    DUV Stepper

    Danmarks Tekniske Universitet - DTU

    DUV Stepper

    1. Supplier selection

      Jan 23, 12:00 AMJanuary 23, 2026 12:00 AM
    2. Result notice published

      Jan 23, 11:12 AMJanuary 23, 2026 11:12 AM
    3. Contract signed

      Feb 19, 12:00 AMFebruary 19, 2026 12:00 AM
    4. Change in result

      Mar 9, 7:39 AMMarch 9, 2026 7:39 AM

    Brief

    Denmark: Tenders/Danmarks Tekniske Universitet - DTU/DUV Stepper

    Awarded

    The competition has ended and a winner has been selected.

    Brief

    Elektrisk utstyr og belysning

    Danmarks Tekniske Universitet - DTU har indgået en aftale med Canon Europe N.V. om levering af en ny DUV stepper til chipsproduktion og -udvikling i Danmark, med en varighed på 1 år og en værdi på 6.675.000 €. Udstyret skal kunne håndtere forskellige wafertyper og -størrelser (Silicon, LNOI, Borofloat, quartz, III-V; 100mm, 150mm og 200mm i diameter) med en multi-wafer håndteringskit for nem skift mellem mindst 150mm og 200mm wafers. Wafertykkelser fra 350µm til 1000µm skal kunne håndteres, og udstyret skal have mulighed for off-axis og dipol belysning samt gennem-silicium justering. Det er essentielt, at eksisterende retikler og jobfiler fra DUV stepper FPA-3000EX4 kan genbruges og nemt overføres. Hovedkroppens fodaftryk må ikke overstige 2000mm x 3000mm x 2700mm (B x D x H) på grund af pladsbegrænsninger.

    Result

    Winner
    Canon Europe N.V.
    Number of bids
    1
    Contract value
    €6,675,000

    About the bid

      To ensure the continuation of small and medium sized companies chip production and development in Danmark DTU Nanolab want to purchase a new (non-refurbished) DUV stepper using a 248 nm wavelength laser as illumination source (KrF laser unit from CYMER). It must furthermore be possible to handle several different wafer types and sizes: Wafer materials: Silicon, LNOI, Borofloat, quartz, III-V Wafer sizes in diameter: 100mm, 150mm and 200mm, furthermore it must be equipped with a multi wafer handling kit such that easy switching between at least 150mm and 200mm wafers is possible without longer downtime for reconfiguration of the equipment. Wafer thickness to be handled are from 350µm up to 1000µm and they can come with a bow up to at least +/- 200um for some wafers. As well as wafers with either notch or primary and secondary flats. It should also be equipped with a through silicon alignment possibility. The equipment must further have the possibility of off-axis as well as dipole illumination. Reuse of existing reticles and easy transfer of existing job files from the DUV stepper FPA-3000EX4 are essential. Due to space restriction the footprint of the main body must not exceed 2000mm x 3000mm x 2700mm (W x D x H).

      Contact name
      Katrine Freiesleben Petersen
      Contact phone
      +45 45252525
      Contact email
      kafre@dtu.dk
      Address
      Anker Engelunds Vej 1, 2800 Kgs. Lyngby

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    Award Criteria

    • Description

      This contract is awarded directly to a bidder based on quality.

    Qualification requirements

      Found no qualification requirements in the contract notice.

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    See the full notice

    Contracting authority
    Danmarks Tekniske Universitet - DTU
    Title
    DUV Stepper
    Type
    ResultPrequalification
    Main code
    31700000Electronic, electromechanical and electrotechnical supplies
    Supplemental codes
    31000000Electrical machinery, apparatus, equipment and consumables; lighting42000000Industrial machinery42900000Miscellaneous general and special-purpose machinery42990000Miscellaneous special-purpose machinery73300000Design and execution of research and development
    Location
    Københavns omegn
    Duration
    1 year

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