DUV Stepper
Awarded
The competition has ended and a winner has been selected.
Elektrisk utstyr og belysning
Danmarks Tekniske Universitet - DTU har indgået en aftale med Canon Europe N.V. om levering af en ny DUV stepper til chipsproduktion og -udvikling i Danmark, med en varighed på 1 år og en værdi på 6.675.000 €. Udstyret skal kunne håndtere forskellige wafertyper og -størrelser (Silicon, LNOI, Borofloat, quartz, III-V; 100mm, 150mm og 200mm i diameter) med en multi-wafer håndteringskit for nem skift mellem mindst 150mm og 200mm wafers. Wafertykkelser fra 350µm til 1000µm skal kunne håndteres, og udstyret skal have mulighed for off-axis og dipol belysning samt gennem-silicium justering. Det er essentielt, at eksisterende retikler og jobfiler fra DUV stepper FPA-3000EX4 kan genbruges og nemt overføres. Hovedkroppens fodaftryk må ikke overstige 2000mm x 3000mm x 2700mm (B x D x H) på grund af pladsbegrænsninger.
Result
- Winner
- Canon Europe N.V.
- Number of bids
- 1
- Contract value
- €6,675,000
About the bid
- Contact name
- Katrine Freiesleben Petersen
- Contact phone
- +45 45252525
- Contact email
- kafre@dtu.dk
- Address
- Anker Engelunds Vej 1, 2800 Kgs. Lyngby
To ensure the continuation of small and medium sized companies chip production and development in Danmark DTU Nanolab want to purchase a new (non-refurbished) DUV stepper using a 248 nm wavelength laser as illumination source (KrF laser unit from CYMER). It must furthermore be possible to handle several different wafer types and sizes: Wafer materials: Silicon, LNOI, Borofloat, quartz, III-V Wafer sizes in diameter: 100mm, 150mm and 200mm, furthermore it must be equipped with a multi wafer handling kit such that easy switching between at least 150mm and 200mm wafers is possible without longer downtime for reconfiguration of the equipment. Wafer thickness to be handled are from 350µm up to 1000µm and they can come with a bow up to at least +/- 200um for some wafers. As well as wafers with either notch or primary and secondary flats. It should also be equipped with a through silicon alignment possibility. The equipment must further have the possibility of off-axis as well as dipole illumination. Reuse of existing reticles and easy transfer of existing job files from the DUV stepper FPA-3000EX4 are essential. Due to space restriction the footprint of the main body must not exceed 2000mm x 3000mm x 2700mm (W x D x H).
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Award Criteria
Description
This contract is awarded directly to a bidder based on quality.
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See the full notice
- Contracting authority
- Danmarks Tekniske Universitet - DTU
- Title
- DUV Stepper
- Type
- Main code
- Supplemental codes
- Location
- Københavns omegn
- Duration
- 1 year