FBH-02 Prior Information Notice – Wet Chemical Processing Tool (Single Wafer Etching)

Prior Information Notice – Laser Manufacturing System for Wafer Processing

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of a laser-based manufacturing system for advanced wafer processing, which will be used for various opto-mechanical processing steps including wafer dicing, laser ablation of thin layers, via drilling for backside processes, and laser-based decomposition of bonding layers. The system must be capable of processing different semiconductor materials such as SiC, GaN, Si, GaAs and InP for wafer sizes up to 200 mm, and comply with ISO class 5 requirements, including laser protection class 1. The estimated maximum total contract value is 1,292,000 EUR.

Prior Information Notice – Maskless Laser Lithography System

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of a high-performance maskless laser lithography system for high-resolution patterning of semiconductor wafers to support the development of advanced heterointegration technologies. The system must provide sub-micron precision combined with high throughput, support modern multi-beam laser writing technologies, and comply with ISO class 5 requirements for installation in a cleanroom environment. The estimated maximum total contract value is 510,000 EUR.

Prior Information Notice – Wafer Dicing Equipment

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of mechanical wafer dicing equipment for backend processing, which will be used for the separation of semiconductor wafers into individual chips. The equipment should support wafers up to 200 mm in diameter and be suitable for various semiconductor materials, ensuring precise and reproducible dicing processes using mechanical blade-based technology. The system must be compatible with ISO class 7 cleanroom requirements.

Prior Information Notice – Wafer Thinning Equipment

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of wafer thinning equipment for backend processing, which will be used for thinning semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN, and silicon. The equipment must enable precise thickness control and process monitoring, including in-situ measurement capabilities, and be compatible with ISO class 5 cleanroom requirements. The estimated maximum total contract value is 250,000 EUR.

Prior Information Notice – Eddy Current Wafer Mapping System

Das Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik, plant die Beschaffung eines Wirbelstrom-Wafer-Mapping-Systems zur zerstörungsfreien elektrischen Charakterisierung von Halbleiterwafern während der Verarbeitung, einschließlich Flächenwiderstands- und Leitfähigkeitsmessungen. Das System soll die Prozessüberwachung und Qualitätskontrolle in der fortschrittlichen Halbleiterfertigung unterstützen. Der geschätzte maximale Gesamtauftragswert beträgt 248.000 EUR.