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    Ion beam deposition system

    Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik

    Ion beam deposition system

    1. Planning notice published

      Oct 20, 7:22 AMOctober 20, 2026 7:22 AM

    2. Planned competition start

      Jan 4, 2027 12:00 AMJanuary 4, 2027 12:00 AM

    Brief

    Germany: Tenders/Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik/Ion beam deposition system

    Planned

    The competition has not been announced yet.

    Qualification deadline
    Jan 4, 202767 days left
    Procedure
    With negotiationTwo stages
    Agreement
    Buying goods
    Estimated value
    €2M

    Brief

    Ferdinand-Braun-Institut gGmbH Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of a dual ion beam system for its GaAs Laser Chiplets pilot line to increase coating capabilities and throughput. The system should be capable of ion beam deposition, ion beam etching, and dual ion beam sputtering, with high uniformity over an 8” wafer, a target-carousel with 4 targets, automatic wafer handling, and the ability to process jigs with laser bars. The estimated maximum total contract value is 2,009,000 EUR.

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      The suppliers who have won similar contracts at Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik

    From the notice

    • The Ferdinand-Braun-Institut (FBH) extends its cleanroom equipment in order to realize pilot-lines for bipolar InP-Chiplets and GaAs Laser Chiplets. The FBH wants to acquire a dual ion beam system for its GaAs Laser Chiplets pilot line in order to increase its coating capabilities as well as increase throughput. The Ion beam system should be able to coat laser bars, laser coupons and PICs that are mounted in jigs and wafers up to a diameter of 200 mm with high quality optical coatings such as Al2O3, TiO2, SiO2 and Ta2O5. Key system specifications • Dual chamber (loadlock and process chamber) system capable of ion beam deposition, ion beam etching and dual ion beam sputtering • High level of uniformity over an 8” Wafer • Target-carousel with 4 targets for changing targets without venting the system • Automatic wafer handling • Capability to transfer and process jigs with laser bars having a resonator length larger than 10 mm. • Possibility to control processes using an optical thickness monitor • Small footprint due to the limited space that is available in the cleanroom Interface to MES Details to be clarified in the negotiation process; the tool delivers logfiles, which is the basic requirement for integration into the FBH-MES. A full integration using a SECS/Gem interface is desirable.

    • Contact

      Abteilung Vergabevergabe@fbh-berlin.de
    • Type
      Planning · Prequalification
    • Location
      Berlin
    • Main code
      Miscellaneous special-purpose machinery
      42990000

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