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    Prior Information Notice – Wafer Dicing Equipment

    Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik

    Prior Information Notice – Wafer Dicing Equipment

    1. Planning notice published

      Jun 10, 6:58 AMJune 10, 2026 6:58 AM

    2. Planned competition start

      Sep 1, 12:00 AMSeptember 1, 2026 12:00 AM

    Brief

    Germany: Tenders/Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik/Prior Information Notice – Wafer Dicing Equipment

    Published deadline passed

    The published deadline has passed. For multi-stage competitions a later tender deadline may still apply — check the notice or portal for the current phase.

    Brief

    Anleggsmaskiner og utstyr

    Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of mechanical wafer dicing equipment for backend processing, which will be used for the separation of semiconductor wafers into individual chips. The equipment should support wafers up to 200 mm in diameter and be suitable for various semiconductor materials, ensuring precise and reproducible dicing processes using mechanical blade-based technology. The system must be compatible with ISO class 7 cleanroom requirements.

    About the bid

      The Ferdinand-Braun-Institut (FBH) plans to procure mechanical wafer dicing equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the separation of semiconductor wafers into individual chips (dicing). It shall support wafers up to 200 mm in diameter and be suitable for various semiconductor materials such as Si, SiC, GaN, InP and GaAs. The equipment is intended to ensure precise and reproducible dicing processes using mechanical blade-based technology. It will be installed in a cleanroom environment and must be compatible with ISO class 7 requirements. The procurement procedure is planned for 2026.

      Contact name
      Kerstin Tobis
      Contact phone
      4930639258384
      Contact email
      kerstin.tobis@fbh-berlin.de
      Address
      Gustav-Kirchhoff-Straße 4, 12489 Berlin

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    See the full notice

    Contracting authority
    Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik
    Title
    Prior Information Notice – Wafer Dicing Equipment
    Type
    Planning
    Main code
    42990000Miscellaneous special-purpose machinery
    Supplemental codes

    No supplemental codes from buyer…

    Estimated value
    €275,000.00

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