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    Prior Information Notice – Wafer Thinning Equipment

    Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik

    Prior Information Notice – Wafer Thinning Equipment

    1. Planning notice published

      Jun 10, 6:19 AMJune 10, 2026 6:19 AM

    2. Planned competition start

      Sep 1, 12:00 AMSeptember 1, 2026 12:00 AM

    Brief

    Germany: Tenders/Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik/Prior Information Notice – Wafer Thinning Equipment

    Published deadline passed

    The published deadline has passed. For multi-stage competitions a later tender deadline may still apply — check the notice or portal for the current phase.

    Brief

    Anleggsmaskiner og utstyr

    Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of wafer thinning equipment for backend processing, which will be used for thinning semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN, and silicon. The equipment must enable precise thickness control and process monitoring, including in-situ measurement capabilities, and be compatible with ISO class 5 cleanroom requirements. The estimated maximum total contract value is 250,000 EUR.

    About the bid

      The Ferdinand-Braun-Institut (FBH) plans to procure wafer thinning equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the thinning of semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN and silicon. Wafer thinning is a key process step prior to wafer singulation. The equipment is intended to enable precise thickness control and process monitoring, including in-situ measurement capabilities. It will be installed in a cleanroom environment and must be compatible with ISO class 5 requirements. The procurement procedure is planned for 2026.

      Contact name
      Kerstin Tobis
      Contact phone
      +493063928384
      Contact email
      vergabe@fbh-berlin.de
      Address
      Gustav-Kirchhoff-Straße 4, 12489 Berlin

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    See the full notice

    Contracting authority
    Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik
    Title
    Prior Information Notice – Wafer Thinning Equipment
    Type
    Planning
    Main code
    42990000Miscellaneous special-purpose machinery
    Supplemental codes

    No supplemental codes from buyer…

    Estimated value
    €250,000.00

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