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    Wafer metrology

    TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

    Wafer metrology

    1. Competition notice published

      Apr 24, 11:07 AMApril 24, 2026 11:07 AM

    2. Contract signed

      Jul 1, 12:00 AMJuly 1, 2026 12:00 AM

    3. Result notice published

      Aug 28, 8:29 AMAugust 28, 2026 8:29 AM

    Brief

    Finland: Tenders/TEKNOLOGIAN TUTKIMUSKESKUS VTT OY/Wafer metrology

    Awarded

    The competition has ended and a winner has been selected.

    Award
    Quality 10%
    Procedure
    OpenSingle stage
    Agreement
    Buying goodsover 3 years

    Brief

    VTT Technical Research Centre of Finland Oy on tehnyt sopimuksen FRT GmbH:n kanssa puolijohdeteollisuudessa tyypillisten substraattien, kuten piikiekkojen, sirujen ja pinottujen kiekkojen, puoliksi automaattisesta kiekkomittauslaitteesta. Toimitus tapahtuu Helsinki-Uusimaalla, ja sopimuksen arvo on 464 674 euroa 36 kuukauden ajaksi. Laitteen tuli olla yhteensopiva ISO 4 -luokitellun puhdastilan kanssa. Tarjouskilpailuun osallistui yksi toimittaja.

    Laboratorie- og analyseutstyr

    Result

    • FRT GmbH
      Winner
    • Number of bids
      1
    • Contract value
      €464,674

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    Award Criteria

    • Description

      The evaluation of the tenders is described in section 'Grounds for decision'.

      Source

      No source found in the documents. Check the weight against the tender documents.

    • Description

      The evaluation of the tenders is described in section 'Grounds for decision'.

      Source

      No source found in the documents. Check the weight against the tender documents.

    Previous winners

    • Who are you up against?

      The suppliers who have won similar contracts at TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

    From the notice

    • The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.Main features of the procedureThe tender process was based on the open procedure applicable to contracts that exceed the EU procurement threshold.

    • Contact

      VTT Technical Research Centre of Finland Ltdkilpailutus@vtt.fi
    • Type
      Result
    • Location
      Helsinki-Uusimaa
    • Main code
      Laboratory, optical and precision equipments (excl. glasses)
      38000000
    • 38300000Measuring instruments

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