Search
  • Search

    Notice of discontinuation: Edge-Handling Sputtering Cluster Tool

    TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

    Notice of discontinuation: Edge-Handling Sputtering Cluster Tool

    1. Competition notice published

      Aug 6, 7:49 AMAugust 6, 2026 7:49 AM

    2. Result notice published

      Oct 13, 7:10 AMOctober 13, 2026 7:10 AM

    3. Contract start date

      Nov 1, 12:00 AMNovember 1, 2026 12:00 AM

    Brief

    Finland: Tenders/TEKNOLOGIAN TUTKIMUSKESKUS VTT OY/Notice of discontinuation: Edge-Handling Sputtering Cluster Tool

    Cancelled

    The competition has been cancelled.

    Award
    Quality 20%
    Procedure
    OpenSingle stage
    Agreement
    Buying goodsover 14 months

    Brief

    VTT Technical Research Centre of Finland Ltd has cancelled the tender process for an edge-handling sputtering cluster tool due to lack of funding. The procurement was for a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end in Helsinki-Uusimaa, with a deposition chamber with four magnetron sputtering sources. The contract duration was intended to be 14 months. Two bids were received.

    Laboratorie-, optisk- og presisjonsutstyr

    Result

    TED
    • Reason for cancellation
      Besluttning av oppdragsgiveren på grunn av manglende finansiering
    • Number of bids
      2

    Custom Assessment Criteria

    • Get answers to your bid/no-bid criteria

      Set them up once and Cobrief answers them in every tender

    Will you bid?

    The agent sets up the bid and writes the first draft. Free for 14 days.

    Award Criteria

    • Description

      The evaluation of the tenders is described in section 'Grounds for decision'.

      Source

      No source found in the documents. Check the weight against the tender documents.

    • Description

      The evaluation of the tenders is described in section 'Grounds for decision'.

      Source

      No source found in the documents. Check the weight against the tender documents.

    Previous winners

    • Who are you up against?

      The suppliers who have won similar contracts at TEKNOLOGIAN TUTKIMUSKESKUS VTT OY

    From the notice

    • The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.Main features of the procedureThe tender process is based on the open procedure applicable to contracts that exceed the EU procurement threshold.

    • Contact

      VTT Technical Research Centre of Finland Ltdkilpailutus@vtt.fi
    • Type
      Result
    • Location
      Helsinki-Uusimaa
    • Main code
      Laboratory, optical and precision equipments (excl. glasses)
      38000000
    • 38800000Industrial process control equipment and remote-control equipment38810000Industrial process control equipment

    Similar active competitions

    • Danmarks Tekniske Universitet - DTU

      Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics

      Danmarks Tekniske Universitet - DTU needs an ICP Reactive ion etcher for silicon dielectrics, to be delivered and installed in the DTU Nanolab cleanroom in the Copenhagen area. The instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures to depths of several tens of microns, requiring exceptional process controllability and tunability for ultra-precise, low-rate etches (< 100 nm/min) and high etch rate deep etches (approaching 500 nm/min). It must accommodate all silicon dielectrics of the form SixNy, SixOx, and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists, and UV/DUV photoresists with high mask selectivity. The instrument must be configured for 150 mm wafer processing, with an option for a complete kit for 200 mm wafer processing. DTU will also have the option to purchase one additional identical instrument. Award criteria are Functionality and performance (50%), Quality of submitted samples (30%), and Price (20%).

      Competition
      Nov 23, 2026(25 days)

    • Fraunhofer-Gesellschaft - Einkauf B12

      Laboratorieutstyr og analyseinstrumenter

      High Temperature 200 mm Ion Implanter - PR1293607-2790-W

      Fraunhofer-Gesellschaft - Einkauf B12 needs a High Temperature 200 mm Ion Implanter for delivery in Erlangen, Kreisfreie Stadt, over a duration of 12 months. The award criteria are Technical Details (65%) and Price (35%). Suppliers must provide information on turnover for the last 3 financial years.

      Competition with qualification
      Nov 9, 2026(11 days)

    • Technische Universiteit Eindhoven

      Dielectric Etcher

      Technische Universiteit Eindhoven needs the delivery and installation of a Dielectric Etcher 1 for a duration of 60 months in Zuidoost-Noord-Brabant. The award criteria are Price (30%) and Quality (70%).

      Competition
      Nov 25, 2026(27 days)