Prior Information Notice – Laser Manufacturing System for Wafer Processing

Prior Information Notice – Maskless Laser Lithography System

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of a high-performance maskless laser lithography system for high-resolution patterning of semiconductor wafers to support the development of advanced heterointegration technologies. The system must provide sub-micron precision combined with high throughput, support modern multi-beam laser writing technologies, and comply with ISO class 5 requirements for installation in a cleanroom environment. The estimated maximum total contract value is 510,000 EUR.

Prior Information Notice – Wafer Dicing Equipment

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of mechanical wafer dicing equipment for backend processing, which will be used for the separation of semiconductor wafers into individual chips. The equipment should support wafers up to 200 mm in diameter and be suitable for various semiconductor materials, ensuring precise and reproducible dicing processes using mechanical blade-based technology. The system must be compatible with ISO class 7 cleanroom requirements.

FBH-02 Prior Information Notice – Wet Chemical Processing Tool (Single Wafer Etching)

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of a wet chemical processing tool for single wafer etching, intended for processing compound semiconductor materials like InP, GaAs, AlGaAs, and GaN. The tool must enable highly precise and reproducible etching processes on a per-wafer basis, including endpoint detection functionality, and be compatible with ISO class 5 cleanroom requirements. The estimated maximum total contract value is 1,710,000 EUR.

Prior Information Notice – Wafer Thinning Equipment

Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik is planning the procurement of wafer thinning equipment for backend processing, which will be used for thinning semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN, and silicon. The equipment must enable precise thickness control and process monitoring, including in-situ measurement capabilities, and be compatible with ISO class 5 cleanroom requirements. The estimated maximum total contract value is 250,000 EUR.

Prior Information Notice – Eddy Current Wafer Mapping System

Das Ferdinand-Braun-Institut gGmbH, Leibniz-Institut für Höchstfrequenztechnik, plant die Beschaffung eines Wirbelstrom-Wafer-Mapping-Systems zur zerstörungsfreien elektrischen Charakterisierung von Halbleiterwafern während der Verarbeitung, einschließlich Flächenwiderstands- und Leitfähigkeitsmessungen. Das System soll die Prozessüberwachung und Qualitätskontrolle in der fortschrittlichen Halbleiterfertigung unterstützen. Der geschätzte maximale Gesamtauftragswert beträgt 248.000 EUR.